Alexandria Digital Research Library

2.5D Embedded Wafer Level Processing for Optoelectronic Integration

Author:
University of California, Santa Barbara. Electrical & Computer Engineering and Sodhi, Avantika
Place of Publication:
[Santa Barbara, Calif.]
Publisher:
University of California, Santa Barbara
Creation Date:
2017
Issued Date:
2017
Keywords:
Through wafer etch
Optoelectronic integration
Interface toughness
Embedded Wafer Level Processing
Adhesive bonding
Thermal residual stress
Format:
Text
Collection(s):
UCSB electronic theses and dissertations
ARK:
ark:/48907/f3rx9c8g
Merritt ARK:
ark:/13030/m5hj1hx7
Catalog System Number:
990047729580203776
Rights:
Inc.icon only.dark In Copyright
Copyright Holder:
Avantika Sodhi
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